材料科学
光电子学
氧化铟锡
铟
透明导电膜
电极
异质结
铜
太阳能电池
硅
导电体
硒化铜铟镓太阳电池
退火(玻璃)
锌
磷化铟
堆栈(抽象数据类型)
电流密度
图层(电子)
非阻塞I/O
氧化物
锡
激光线宽
作者
Guangze He,Sheng Ma,Zhengping Li,Wenzhong Shen
出处
期刊:Solar RRL
[Wiley]
日期:2026-08-24
卷期号:10 (16)
摘要
The rapid scaling of silicon heterojunction (SHJ) solar cell manufacturing is constrained by the scarcity and price volatility of indium and silver. In this study, a low‐indium and low‐silver SHJ cell structure was designed by Sentaurus TCAD optoelectronic simulation. The optimized configuration adopts a front multilayer transparent conductive oxide (TCO) stack of 5 nm indium tin oxide (ITO)/50 nm aluminum‐doped zinc oxide (AZO)/5 nm ITO with a 110 nm SiN x :H antireflection layer, a 70 nm AZO rear TCO layer, and silver‐coated copper (Ag@Cu) electrodes with a 25 μm linewidth and 80% copper core ratio. The simulated device reduces indium consumption by 92.8% and silver usage by 80% while reaching a simulated efficiency of 26.76% (open‐circuit voltage V oc = 754.1 mV, short‐circuit current density J sc = 42 mA/cm 2 , and fill factor FF = 84.49%). The simulation‐guided design integrates optical compensation by SiN x :H, carrier transport through the ultrathin ITO/AZO/ITO stack, and reduced‐shading Ag@Cu electrodes, suggesting a feasible route for lowering critical‐metal consumption in high‐efficiency SHJ solar cells.
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