材料科学
胡须
复合材料
硅橡胶
碳纳米管
热导率
微电子
导电体
千分尺
陶瓷
界面热阻
散热膏
天然橡胶
电磁屏蔽
传热
热阻
纳米技术
物理
光学
热力学
作者
Xiaowang Ji,Zhaoyu Lu,Junyan Wang,Neng Ye,Huan Zhang,Letian Zhou,Jingchao Li,Yonglai Lu
标识
DOI:10.1016/j.compscitech.2024.110495
摘要
High-performance electronics urgently need more effective thermally conductive rubber composites to solve interfacial heat transfer problems in the thermal management systems. Tiny amounts nanocarbon materials (NCM) can significantly improve the thermal conductivity of conventional ceramic-filled rubber composites, but the volume exclusion effect of micrometer ceramic fillers makes NCM highly susceptible to the formation of the conductive pathways, which inevitably leads to the substantial decrease in the volume resistivity of the materials, posing a safety hazard, such as short circuits, to electronic devices. Here, we report an electrostatic self-assembly method to prepare CNW@n-Al2O3 hybrids by loading nano-alumina (n-Al2O3) onto carbon nanotube whiskers (CNW) and co-filling them with micrometer alumina (m-Al2O3) to silicone rubber, constructing a micro-nano-multi-level hybrid network structure, which can fully utilize the high thermal conductivity while shielding the electrical conductivity of CNW. The resulting composite filled with 2 phr of CNW@n-Al2O3 exhibits a significantly enhanced thermal conductivity of 1.137 W/(m·K) and a high volume resistance of 1.323 × 109 Ω cm, and is proved to be used as an excellent thermal interface material to assist the heat dissipation of the microelectronic chip. This study provides a facile and effective strategy for the design of thermally conductive yet electrically insulating rubber composites filled with CNW, which shows a bright application prospect in the thermal management of high-performance electronic devices.
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