转印
材料科学
纳米技术
墨水池
基质(水族馆)
可扩展性
数码产品
灵活性(工程)
计算机科学
电气工程
工程类
海洋学
统计
数学
数据库
复合材料
地质学
作者
Yunda Wang,Scott E. Solberg,Jiawei Lu,Qian Wang,Nathan L. Chang,David E. Schwartz,Mahati Chintapalli
出处
期刊:AIP Advances
[American Institute of Physics]
日期:2022-06-01
卷期号:12 (6)
被引量:6
摘要
Micro-transfer printing is an emerging assembly technique to deterministically transfer ink comprising micro-/nano-objects from a donor substrate to a receiver substrate. This technique has generated increasing interest over the last decade due to its unique capability of integrating diverse heterogeneous materials into various structures and layouts. The growing number of applications enabled by micro-transfer printing includes flexible electronics, sensors, photovoltaics, and micro-LED displays. This work presents a micro-transfer printing approach, which relies on thermally induced adhesion modulation of shape memory polymer materials. An individually addressable micro-fabricated resistive heater array is used to locally deliver the heat for transfer pixel actuation. Selectively transferring chips from a closely packed microchip donor array (pitch: 100 µm, size: 50 × 50 µm2) is demonstrated. The transfer head can be dynamically configured to assemble micro-objects in arbitrary patterns, allowing digital manufacturing, object sorting, or in-line assembly correction of defects. These capabilities, together with the simple and robust structure of the transfer head, can enable high process scalability and flexibility for heterogeneous material integration.
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