可靠性(半导体)
MOSFET
可靠性工程
材料科学
工程物理
碳化硅
光电子学
电子工程
电气工程
计算机科学
物理
工程类
晶体管
电压
复合材料
功率(物理)
量子力学
作者
Yongle Zhong,Xinhua He,Zhizhe Wang,Jun Luo,Bin Wang,Qiushuang Li
标识
DOI:10.1109/ceepe62022.2024.10586507
摘要
A comprehensive review of High-Temperature Gate Bias (HTGB) and High-Temperature Reverse Bias (HTRB) reliability in Silicon Carbide Metal-Oxide-Semiconductor Field-Effect Transistors (SiC MOSFETs) was made in this paper. Despite the considerable potential of high power, high voltage, high frequency, and radiation resistance for SiC MOSFETs, the challenge in long-term reliability has limited the application in high-frequency and high-temperature fields. As an effective method to assess long-term reliability of SiC MOSFETs, HTGB and HTRB testing have been widely applied for commercial SiC MOSFETs. The research on the reliability of SiC MOSFETs under HTGB and HTRB has been comprehensively reviewed in this paper, with a focus on the test conditions, deterioration laws of key parameters, and failure mechanisms. This review may serve as a valuable reference for subsequent research on SiC MOSFETs.
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