德拉姆
静态随机存取存储器
存储单元
通用存储器
非易失性随机存取存储器
半导体存储器
感测放大器
晶体管
动态随机存取存储器
内存刷新
CMOS芯片
计算机科学
电容器
沟槽
电气工程
计算机存储器
嵌入式系统
计算机硬件
材料科学
工程类
纳米技术
电压
图层(电子)
标识
DOI:10.1002/9781394202478.ch17
摘要
The memory capacity of DRAM has dramatically increased for half a century since the launch of 1-kbit DRAM in 1970. Specifically the invention of one-transistor-type memory cell (1T-cell) accelerated the DRAM evolution in corporation with the inventions of three-dimensional (3D) memory cells, stacked capacitor cell, and trench capacitor cell. Innovative technologies of DRAM in the past are described in this article referring to the background of 3D memory cell inventions. This article also describes the evolution of SRAM which started by employing 6 transistor (6T) CMOS memory cell and continued to develop innovative technologies to support the scaling the memory cell.
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