材料科学
薄膜晶体管
原子层沉积
薄膜
铟
光电子学
基质(水族馆)
图层(电子)
微观结构
聚萘二甲酸乙二醇酯
等离子体
分析化学(期刊)
纳米技术
复合材料
化学
物理
量子力学
海洋学
色谱法
地质学
作者
TaeHyun Hong,KyoungRok Kim,Suhwan Choi,Seung-Hwan Lee,Ki-Lim Han,Jun Hyung Lim,Jin‐Seong Park
出处
期刊:ACS applied electronic materials
[American Chemical Society]
日期:2022-05-27
卷期号:4 (6): 3010-3017
被引量:9
标识
DOI:10.1021/acsaelm.2c00434
摘要
Indium oxide (InOx) thin films have attractive carrier transport properties for oxide semiconductors because of the large isotropic 5 s orbital overlap. In this study, InOx films were deposited by plasma-enhanced atomic layer deposition (PEALD). We evaluated the effects of the ALD process conditions such as the process temperature, plasma power, and plasma duration time on the microstructure, physical, chemical, and electrical properties of the as-deposited InOx films. The InOx film deposited at an even growth temperature of 100 °C exhibited a polycrystalline structure without impurities. As the growth temperature increased, the (222) orientation became favorable and the surface morphology of the as-deposited films improved. In addition, staggered-bottom gate structure thin-film transistors (TFTs) were fabricated to examine the feasibility of the ALD-processed InOx film as a channel material for TFTs. As the growth temperature increased from 100 to 250 °C, the mobility increased from 3.4 to 12.6 cm2/V s and the hysteresis value decreased from 1.85 to 0.94 V due to increasing carrier concentrations and decreasing defect states, respectively. Finally, a flexible device was fabricated on a polyethylene naphthalate substrate; the device parameters of Vth and μsat were determined to be 2.21 V and 16.6 cm2/V s, respectively. These results demonstrate the potential for fabricating flexible TFT applications using PEALD.
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