Lv11
72 积分 2022-05-06 加入
Statistical method of extracting assembly stresses in over-constrained solder-less press-fit pin technology for vibration reliability analysis
21天前
已完结
Design of a Compliant Press-Fit Pin Connection
21天前
已完结
Characterization of Press-Fit Pin Insertion Behavior in Power Inverter Modules for Vehicles
21天前
已完结
Evaluation of Press-Fit Zone Performance Across PCB Surface Finishes like ENIG, Immersion Tin, Immersion Silver, and OSP
25天前
已完结
Experimental and numerical evaluation of cold plates devised by turing-substantialized topology optimization
1个月前
已完结
Additive manufacturability and heat transfer study of three-dimensional Turing pattern lattices
1个月前
已完结
Additive manufacturability and heat transfer study of three-dimensional Turing pattern lattices
1个月前
已完结
A Modified Lifetime Prediction Model for Power Cycling Reliability of SiC Power Modules Considering Chip Size Effects
3个月前
已完结
Reliability Prediction Platform of SiC Half Bridge Power Module
3个月前
已完结
A Machine Learning Framework to Predict the Thermal Fatigue Lifetime of SiC Module with Sintered Silver Layer
3个月前
已完结
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