Lv11
72 积分 2022-05-06 加入
Experimental and numerical evaluation of cold plates devised by turing-substantialized topology optimization
6小时前
求助中
Additive manufacturability and heat transfer study of three-dimensional Turing pattern lattices
6小时前
求助中
Additive manufacturability and heat transfer study of three-dimensional Turing pattern lattices
7小时前
求助中
A Modified Lifetime Prediction Model for Power Cycling Reliability of SiC Power Modules Considering Chip Size Effects
2个月前
已完结
Reliability Prediction Platform of SiC Half Bridge Power Module
2个月前
已完结
A Machine Learning Framework to Predict the Thermal Fatigue Lifetime of SiC Module with Sintered Silver Layer
2个月前
已完结
Statistical Analysis of Power Semiconductor Devices Lifetime Test and Lifetime Prediction
2个月前
已完结
Development on Fatigue Life Model of Lead-Free Solder for First Failure Prediction
2个月前
已完结
Study on Stress and Reliability of Advanced Intelligent Power Module (IPM) Subjected to Power Cycling
2个月前
已完结
A Time-Efficient Strain-Based Lifetime Prediction Method for Bond Wires Using Vibration Fatigue Tests and Finite Element Modeling
2个月前
已完结
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