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92 积分 2022-05-06 加入
A Modified Lifetime Prediction Model for Power Cycling Reliability of SiC Power Modules Considering Chip Size Effects
14天前
已完结
Reliability Prediction Platform of SiC Half Bridge Power Module
14天前
已完结
A Machine Learning Framework to Predict the Thermal Fatigue Lifetime of SiC Module with Sintered Silver Layer
14天前
已完结
Statistical Analysis of Power Semiconductor Devices Lifetime Test and Lifetime Prediction
14天前
已完结
Development on Fatigue Life Model of Lead-Free Solder for First Failure Prediction
14天前
已完结
Study on Stress and Reliability of Advanced Intelligent Power Module (IPM) Subjected to Power Cycling
14天前
已完结
A Time-Efficient Strain-Based Lifetime Prediction Method for Bond Wires Using Vibration Fatigue Tests and Finite Element Modeling
21天前
已完结
Improving Power Cycle Lifetime of SiC Power Modules with Double-Bonded Wire: Experimental and Simulation Analysis
21天前
已完结
Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module
21天前
已完结
Effect of Chip Metallization and Process Parameters on the Die Attach Properties of Direct Bonded Power Devices
1个月前
已完结
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