Lv2
200 积分 2024-03-15 加入
The ion kinetics at the wafer edge by the variation of geometry and permittivity of the focus ring in capacitively coupled discharges
7天前
已完结
Characterization of an Etch Profile at a Wafer Edge in Capacitively Coupled Plasma
7天前
已完结
Selective etching of SiN against SiO2 and poly-Si films in hydrofluoroethane chemistry with a mixture of CH2FCHF2, O2, and Ar
7天前
已完结
Trends and Future Challenges of 3D NAND Flash Memory
7天前
已完结
Deep silicon etching technology and applications: a review
8天前
已完结
Ion energy distribution measurements in rf and pulsed dc plasma discharges
11天前
已完结
Effects of the focus ring on the ion kinetics at the wafer edge in capacitively coupled plasma reactors
12天前
已完结
Plasma etching of the trench pattern with high aspect ratio mask under ion tilting
12天前
已完结
Investigation on the parameter distribution of Ar/O2 inductively coupled plasmas
3个月前
已完结
Plasma source development for fusion-relevant material testing
3个月前
已完结
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