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144 积分 2022-11-03 加入
Copper Plating on Through Glass Via（TGV）Using Both High-speed Sputtering Process and Wet Process
17天前
已完结
Control of the preferential orientation and properties of HiPIMS and DCMS deposited chromium coating based on bias voltage
18天前
已完结
Stable HiPIMS discharge in a high-aspect-ratio slender tube enabled by a coaxial magnetically confined hollow cathode
18天前
已完结
Large-area structural color TiAlN/Al/TiN/TiAlN coatings with robust adhesion on polycarbonate via sputtering
1个月前
已完结
A novel cu filling method for high-aspect-ratio (AR) nano-scale TSVs
1个月前
已关闭
Deposition rate enhancement in HiPIMS through the control of magnetic field and pulse configuration
1个月前
已完结
A novel cu filling method for high-aspect-ratio (AR) nano-scale TSVs
1个月前
已关闭
High-g MEMS shock threshold sensor integrated on a copper filling through-glass-via (TGV) substrate for surface mount application
1个月前
已完结
Non-plane film and its growth mechanism by magnetron sputtering deposition on glass through via substrate
1个月前
已完结
HiPIMS-Based Cu Seed Layer Deposition for 9:1 Aspect Ratio Through Glass Vias in Advanced 2.5D Packaging
1个月前
已关闭
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