Lv4
466 积分 2022-11-03 加入
Plating High Aspect Ratio Features
23天前
已完结
Effect of bias voltages on the microstructures and superconductive properties of Nb films deposited via HiPIMS
26天前
已完结
Ti atom and Ti ion number density evolution in standard and multi-pulse HiPIMS
26天前
已完结
Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection
2个月前
已完结
Copper Plating on Through Glass Via（TGV）Using Both High-speed Sputtering Process and Wet Process
3个月前
已完结
Control of the preferential orientation and properties of HiPIMS and DCMS deposited chromium coating based on bias voltage
3个月前
已完结
Stable HiPIMS discharge in a high-aspect-ratio slender tube enabled by a coaxial magnetically confined hollow cathode
3个月前
已完结
Large-area structural color TiAlN/Al/TiN/TiAlN coatings with robust adhesion on polycarbonate via sputtering
4个月前
已完结
A novel cu filling method for high-aspect-ratio (AR) nano-scale TSVs
4个月前
已关闭
Deposition rate enhancement in HiPIMS through the control of magnetic field and pulse configuration
4个月前
已完结
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