Lv41
570 积分 2022-09-11 加入
Superconducting Titanium Nitride in Through-Silicon Vias for 3D Integration of Qubits
2小时前
待确认
Through-silicon-via Architecture of 3D Integration for Superconducting Quantum Computing Application
3天前
已完结
金属断口图像识别方法研究
1个月前
已完结
Reactive ion beam etch of highly uniform slanted gratings for augmented reality applications
1个月前
已关闭
Fabrication of blazed gratings by tilted reactive ion beam etching with the side mask for augmented reality applications
1个月前
已完结
Reactive ion beam etch of highly uniform slanted gratings for augmented reality applications
1个月前
已关闭
Solution-processed high-refractive-index coatings for SiC index-matched gratings enabling wide field-of-view augmented-reality displays
1个月前
已完结
Research on wafer-level SiC microgroove array process via integrated molding-etching process
1个月前
已完结
Ligand-field regulation enables high energy-efficiency cathodes for aqueous zinc-ion batteries
4个月前
已完结
Abnormal Chiral Coupling for Efficient and Stable Reduced-Dimensional Perovskite Emitters
4个月前
已完结
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