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128 积分 2023-12-20 加入
Sputtering of (111) Highly-Oriented Nanotwinned Ag on Polycrystalline Si3N4 Substrates for High-power Electronic Packaging
9个月前
已完结
Low-temperature bonding of Cu on Si3N4 substrate by using Ti/Cu thin films
9个月前
已完结
Effects of brazing parameters on interfacial reaction layer characteristics and mechanical performance of brazed Cu/Si3N4 using Ag-Cu-Ti filler alloy
9个月前
已关闭
Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler
9个月前
已关闭
Effect of annealing treatment of Si3N4 ceramics on the joining of Si3N4 ceramic and oxygen-free copper
9个月前
已完结
Enhanced properties in Si3N4/Cu AMB joints through regulating interfacial reaction modes induced by Mo-particle additives
9个月前
已完结
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