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48 积分 2024-07-23 加入
A State‐of‐the‐Art Review of Through‐Silicon Vias : Filling Materials, Filling Processes, Performance, and Integration
8小时前
已完结
Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review
2个月前
已完结
Glycerol Vapor Assisted Cu Direct Bonding: Implications for 3D Semiconductor Packaging
8个月前
已完结
Nanowires in Electronics Packaging
9个月前
已完结
In situ synthesis of metallic nanowire arrays for ionization gauge electron sources
9个月前
已完结
In situ synthesis of metallic nanowire arrays for ionization gauge electron sources
9个月前
已关闭
Encapsulating Plastic Microelectronics
11个月前
已完结
Optimized FE Model for System-Level Solder Joint Reliability Analysis of a Flip-Chip Ball Grid Array Package
11个月前
已完结
A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints
11个月前
已完结
Propensity for Fatigue Failure of the FCBGA UF-Substrate Interface After Prolonged Storage
11个月前
已完结
Hydrogen Plasma Utilization in Advanced Logic Technology
11个月前
已采纳
Silk fibroin microspheres with photothermal nanocarrier encapsulation for anticancer drug delivery
11个月前
已采纳
Bianisotropy Picture of Higher Permeability at Higher Frequencies
1年前
已采纳
Clarifying the Origin of Ordering Effect of PtCo Intermetallic Catalysts in Catalyzing Oxygen Reduction
1年前
已采纳
Hydrothermal synthesis of CeO2 nanoparticles and its application in electrochemical detection of nitrofurantoin antibiotics
1年前
已采纳
Dual-parameter stretchable, transferable mesh piezoresistive sensor for electronic skin detection of strain and temperature changes
1年前
已采纳
A nanosecond Q-switched fiber laser based on step-index multimode fiber
1年前
已采纳
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