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46 积分 2026-09-02 加入
Understanding a Microstructure Using GOS (Grain Orientation Spread) and Its Application to Recrystallization Study of Hot Deformed Al-Cu-Mg Alloys
20分钟前
已完结
Ultrasonic welding of Cu cables bonding: Tensile, porosity and evolution of microstructure
1个月前
已关闭
Microscopic mechanism of ultrasonically welded joints: The role of terminal roughness and wire diameter
1个月前
已完结
Electropulsing-enhanced interfacial recrystallization in ultrasonic consolidation of Cu/Al heterogeneous lamellar structure
1个月前
已完结
Isotropic evolution features during ultrasonic welding of Cu single crystals
1个月前
已完结
Comprehensive review of dimensionality reduction algorithms: challenges, limitations, and innovative solutions
1个月前
已关闭
Review Grain and subgrain characterisation by electron backscatter diffraction
1个月前
已完结
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