| 标题 |
Ultrasonic welding of Cu cables bonding: Tensile, porosity and evolution of microstructure |
| 网址 | |
| DOI | |
| 其它 |
期刊:Science and Technology of Welding and Joining 作者:Xian Ming Cheng; Ke Yang; YF Wu; Jian Wang; Sishu Si Huang 出版日期:2024-05-13 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)