Lv41
630 积分 2025-05-18 加入
On the possibility of diamond wafer bonding in ultrahigh vacuum
20天前
已完结
Oxide-Free SiC-SiC Direct Wafer Bonding and Its Characterization
20天前
已关闭
Characterization of Nanoscopic Cu/Diamond Interfaces Prepared by Surface-Activated Bonding: Implications for Thermal Management
20天前
已完结
Interfacial Thermal Conductance across Room-Temperature-Bonded GaN/Diamond Interfaces for GaN-on-Diamond Devices
20天前
已完结
Surface-activated direct bonding of diamond (100) and c-plane sapphire with high transparency for quantum applications
20天前
已完结
Point Defects Enhance Cross‐Plane Thermal Conductivity In Graphite
1个月前
已完结
Interplay between morphology and thickness of a SiN interlayer for enhanced thermal transport across the GaN/diamond interface
3个月前
已完结
Effect of Non-Fourier Heat Transport on Temperature Distribution in High Bandwidth Memory
4个月前
已完结
effect of Non-Fourier heat transport on temperature disturibution in
4个月前
已关闭
High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes
5个月前
已完结
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