Lv5
912 积分 2021-10-18 加入
Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding
1天前
已完结
Hydrogen Termination Effect on SiO2/Si Interface State Defects of Silicon Hydride and Hydrocarbon Hybrid-Molecular-Ion-Implanted Silicon Epitaxial Wafer
1天前
已完结
Metallic Impurity Gettering Behavior of Hydrocarbon-Molecular-Ion-Implanted Epitaxial Silicon Wafer During the Pn-Junction Diode Fabrication Process
1天前
待确认
Influence of Pixel Design on Charge Transfer Performances in CMOS Image Sensors
1天前
已完结
Implant Angle Monitor System of MC3-II
1个月前
已完结
Process Robustness against Photoresist Outgassing in Single-Wafer High-Energy Implanters
1个月前
已完结
Introduction of the S-UHE, a single-wafer ultra-high energy ion implanter
1个月前
已完结
Precise beam angle control in the S-UHE, SEN's single-wafer ultra-high energy ion implanter
1个月前
已完结
Crystal-trim and its application to investigations on channeling effects during ion implantation
2个月前
已完结
Parameterization of ion channeling half-angles and minimum yields
2个月前
已完结
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