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80 积分 2024-06-22 加入
Factors determining bond wave speed in wafer bonding
4小时前
待确认
Efficient Cu/SiO2 hybrid bonding through alkaline surface modification for 3D IC integration
4小时前
求助中
Enhancement of the Bond Strength and Reduction of Wafer Edge Voids in Hybrid Bonding
4小时前
已完结
Effect of Compressive Stress on Copper Bonding Quality and Bonding Mechanisms in Advanced Packaging
6个月前
已完结
Research progress of hybrid bonding technology for three-dimensional integration
6个月前
已完结
Recent Advances and Trends in Cu–Cu Hybrid Bonding
6个月前
已完结
Diffusion in Silicon. I. Effect of Dislocation Motion on the Diffusion Coefficients of Boron and Phosphorus in Silicon
6个月前
已完结
High voltage time-dependent dielectric breakdown in stacked intermetal dielectrics
6个月前
已完结
Time-dependent dielectric breakdown (TDDB) reliability analysis of CMOS analog and radio frequency (RF) circuits
6个月前
已完结
Effectiveness of Si Seed for Selective SiGe Epitaxial Deposition in Recessed Source and Drain for Locally Strained pMOS Application
6个月前
已完结
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