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274 积分 2025-07-09 加入
Effect of Sn–58Bi (SB) and Sn–3Ag–0.5Cu (SAC) mixing ratio on the thermo-mechanical reliability of SB/SAC composite solder
2天前
已完结
Effect of Sn–58Bi (SB) and Sn–3Ag–0.5Cu (SAC) mixing ratio on the thermo-mechanical reliability of SB/SAC composite solder
23天前
已完结
Microstructure and mechanical properties of Sn58Bi modified Sn1.0Ag0.5Cu/Cu solder joints
23天前
已完结
Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints
23天前
已完结
Interfacial reaction on different solder composition after laser soldering
2个月前
已完结
Numerical simulation and experimental study on wetting of Sn-based solder for laser soldering
3个月前
已完结
Influence of Laser Soldering Temperatures on Through-Hole Component
3个月前
已完结
Numerical simulation and experimental study on wetting of Sn-based solder for laser soldering
3个月前
已完结
Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation
3个月前
已完结
Correction to: Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints
3个月前
已关闭
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