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230 积分 2025-07-09 加入
Preparation, characterization and mechanical properties analysis of SAC305-SnBi-Co hybrid solder joints for package-on-package technology
7小时前
已完结
Study on Sn58Bi/SAC305 low-temperature composite solder paste based on flake solder and its soldering performance
7小时前
已完结
Design and Performance Evaluation of Sn58Bi/SAC305 Layered Composite Solder for Low-Temperature Applications
8小时前
待确认
Performance transformation of Co-added Sn58Bi solder joints under thermal shock conditions for interconnection packaging
8小时前
已完结
Research on the effect of 7K extreme low temperature storage on the electrical and mechanical properties of SAC305/SnPb mixed solder joints
8小时前
已完结
Residual free solder process for fluxless solder pastes
2天前
已完结
An Investigation of Process Parameters Effects on Void Formation in Fluxless Solder Paste for Power Module Packaging Applications via Formic Acid Vacuum Reflow Technology
2天前
已完结
Influences of Organic Acids in the Soldering Flux System on Wettability and Self-alignment Ability of Sn–3.0Ag–0.5Cu Solder Paste during Reflow Process
2天前
已完结
Effect of fibre-lasers parameters on interfacial reaction and wetting angle of two different types of SAC305 solder fabrication on Cu pad
7天前
已完结
Effect of Sn–58Bi (SB) and Sn–3Ag–0.5Cu (SAC) mixing ratio on the thermo-mechanical reliability of SB/SAC composite solder
12天前
已完结
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