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416 积分 2025-07-09 加入
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering
2小时前
待确认
Interfacial reaction of Sn-Ag-Cu-Ni solder/Cu joints by laser process
2小时前
待确认
<title>Laser soldering of Sn-Ag-Cu and Sn-Zn-Bi lead-free solder pastes</title>
2小时前
待确认
Formation and distribution of Sn-Cu IMC in lead-free soldering process induced by laser heating
2小时前
待确认
Laser Soldering of Sn-based Solders with Different Melting Points
2小时前
已完结
Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad
5小时前
已完结
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering
5小时前
已完结
A review: effect of copper percentage solder alloy after laser soldering
5小时前
求助中
Processing treatment of a lead-free Sn–Ag–Cu–Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection
5小时前
已完结
The effect of laser-soldering parameters on the Sn-Ag-Cu/Cu interfacial reaction
5小时前
已完结
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