Lv1
14 积分 2025-05-15 加入
Design and interfacial characterization of high-strength Cu/Si3N4 joints via high-entropy filler engineering
53分钟前
待确认
Theoretical and Numerical Investigation of Acoustic Cavitation Bubble Based on the Impact of Ultrasound Frequency
2个月前
已完结
Low-temperature active soldering of 5A06-Al alloy and Ti-Cu-Ni alloy mesh-reinforced SAC305 composite solder: Interfacial bonding behavior and joint properties
4个月前
已完结
Microstructure and mechanical properties of Sn58Bi modified Sn1.0Ag0.5Cu/Cu solder joints
4个月前
已完结
Cu6Sn5 intermetallic: Reconciling composition and crystal structure
5个月前
已关闭
Ultrasonic-promoted rapid TLP bonding of fine-grained 7034 high strength aluminum alloys
5个月前
已完结
Method Development and Validation for Quantification of Trace Elements in Aluminous Ore (Bauxite) Using Inductively Coupled Plasma–Optical Emission Spectrometry
7个月前
已完结
皖公网安备34019202002308
