Lv0
0 积分 2025-05-15 加入
Effect of La on the Cu–Sn intermetallic compound (IMC) growth and solder joint reliability
1个月前
已完结
Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints
1个月前
已完结
Calculation of Mechanical Properties, Electronic Properties, and Thermodynamic Properties of AuAl Crystal: First‐Principles Calculation
1个月前
已完结
Design and interfacial characterization of high-strength Cu/Si3N4 joints via high-entropy filler engineering
1个月前
已完结
Theoretical and Numerical Investigation of Acoustic Cavitation Bubble Based on the Impact of Ultrasound Frequency
3个月前
已完结
Low-temperature active soldering of 5A06-Al alloy and Ti-Cu-Ni alloy mesh-reinforced SAC305 composite solder: Interfacial bonding behavior and joint properties
6个月前
已完结
Microstructure and mechanical properties of Sn58Bi modified Sn1.0Ag0.5Cu/Cu solder joints
6个月前
已完结
Cu6Sn5 intermetallic: Reconciling composition and crystal structure
7个月前
已关闭
Ultrasonic-promoted rapid TLP bonding of fine-grained 7034 high strength aluminum alloys
7个月前
已完结
Method Development and Validation for Quantification of Trace Elements in Aluminous Ore (Bauxite) Using Inductively Coupled Plasma–Optical Emission Spectrometry
9个月前
已完结
皖公网安备34019202002308
