Lv41
550 积分 2025-12-26 加入
Atomic layer etching of SiO2 with self-limiting behavior on the surface modification step using sequential exposure of HF and NH3
1个月前
已完结
Shaping the future: the power of advanced OPC and mask technology
1个月前
已关闭
New EUV mask blank for N3 technology node and beyond
1个月前
已完结
WET and Siconi® cleaning sequences for SiGe epitaxial regrowth
1个月前
已完结
Neutral transport during etching of high aspect ratio features
1个月前
已完结
Memory technology: process and cell architecture
2个月前
已完结
Laser annealing technology for storage node contact in 10 nm-class DRAM
2个月前
已完结
Review of Material Properties of Oxide Semiconductor Thin Films Grown by Atomic Layer Deposition for Next-Generation 3D Dynamic Random-Access Memory Devices
2个月前
已完结
Atomic layer deposition of high-k and metal thin films for high-performance DRAM capacitors: a brief review
2个月前
已完结
The investigation of DARC etch back in DRAM capacitor oxide mask opening
2个月前
已完结
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