Lv4
420 积分 2025-12-26 加入
Neutral transport during etching of high aspect ratio features
6天前
已完结
Progress report on high aspect ratio patterning for memory devices
6天前
已完结
Dry etching in the presence of physisorption of neutrals at lower temperatures
6天前
已完结
Exploration of BEOL line-space patterning options at 12 nm half-pitch and below
6天前
已完结
Mechanism and Effect of 4-Level RF Pulsing on Etching Process in Advanced Node
7天前
已完结
Hydrofluoroethane plasma etching of SiN, SiO2, and poly-Si films with CHF2CF3, CF3CH3, and CHF2CH3
7天前
已完结
Plasma etching: Yesterday, today, and tomorrow
8天前
已完结
Study of SiO2 Etching Processing with CH4/SF6 Plasmas
8天前
已完结
Selective pulsed chemical vapor deposition of water-free HfOx on Si in preference to SiCOH and passivated SiO2
8天前
已完结
Inherently Selective Water-Free Deposition of Titanium Dioxide on the Nanoscale: Implications for Nanoscale Patterning
8天前
已完结