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30 积分 2026-08-14 加入
An RDL Modeling and Thermo-Mechanical Simulation Method of 2.5D/3D Advanced Package Considering the Layout Impact Based on Machine Learning
1天前
已完结
High-performance bonding of polyimide to copper using polyamide-imide adhesive: Process optimization and atomic-scale mechanism elucidation
1个月前
已完结
Polyimides with low dielectric constants and dissipation factors at high frequency derived from novel aromatic diamines with bistrifluoromethyl pendant groups
1个月前
已完结
Progress in low dielectric polyimide film – A review
1个月前
已完结
High-temperature energy storage polyimide dielectric materials: polymer multiple-structure design
1个月前
已完结
Optimizing the Charge Transfer Complex Structure of Polyimides with Fluorinated Side Biphenyl for Superior High‐Temperature Capacitive Performance
1个月前
已完结
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