Lv5
1090 积分 2025-04-19 加入
The microparticles adhesion and removal dynamics in wafer-scale physical cleaning process
3个月前
已完结
Thermal Conductivity of Silicon and Germanium from 3°K to the Melting Point
3个月前
已完结
Thickness of film produced by pressure atomizing nozzles
3个月前
已完结
Temporally sparse data assimilation for the small-scale reconstruction of turbulence
3个月前
已完结
Multi-fidelity reduced-order surrogate modelling
3个月前
已完结
S-PINN: physics-informed neural networks for solving weakly hyperbolic systems
4个月前
已完结
S-PINN: physics-informed neural networks for solving weakly hyperbolic systems
4个月前
已完结
Multi-step process optimization on high aspect ratio etching for memory devices
4个月前
已完结
Simulation of high-speed droplet impact against a dry/wet rigid wall for understanding the mechanism of liquid jet cleaning
4个月前
已完结
Multi-objective optimal design of semiconductor cleanroom air-conditioning systems considering load uncertainty and equipment degradation
4个月前
已完结
皖公网安备34019202002308
