Lv32
340 积分 2025-06-21 加入
The effect of non-reactive alloying elements on the growth kinetics of the intermetallic compound between liquid Sn-based eutectic solders and Ni substrates
1个月前
已完结
Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures
1个月前
已完结
Influence of crystalline structure on diffusion barrier property of electroless Ni–Fe–P coatings in Zn–Al solder interconnects
1个月前
已完结
Significantly retarded interfacial reaction between an electroless Ni–W–P metallization and lead-free Sn–3.5Ag solder
1个月前
已完结
Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability
1个月前
已完结
Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging
1个月前
已完结
Interface Reaction between Tin Solder and Nanocrystalline Ni and Ni-Mo Coatings Obtained by Electrodeposition
1个月前
已完结
Reaction kinetics of Ni/Sn soldering reaction
1个月前
已完结
A new investigation of the system Ni–Sn
1个月前
已完结
Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
1个月前
已完结
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