Lv4
648 积分 2025-06-21 加入
Microstructure evolution of Sn-Cu based solder paste on electroless nickel immersion gold (ENIG) surface finish subjected to multiple reflow cycles
15天前
已完结
Characteristics of Cu6Sn5 grains formed on different Cu substrates under temperature gradient
1个月前
已完结
Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding
1个月前
已完结
Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient
1个月前
已完结
Suppression of Kirkendall Voids at the Interface of Sn/nc-Cu Solder Joint
1个月前
已完结
Ni Barrier Symmetry Effect on Electromigration Failure Mechanism of Cu/Sn–Ag Microbump
1个月前
已完结
Electroplated Ni-W-P Amorphous Layer and the Interaction Between Ni-W-P Barrier and Sn-Bi Solder
1个月前
已完结
Structure characterization of nanocrystalline Ni–W alloys obtained by electrodeposition
4个月前
已完结
Fabrication and characterization of boron nitride reinforced Ni–W nanocomposite coating by electrodeposition
4个月前
已完结
Wear and Corrosion Properties of Crystalline Ni-W Alloy Coatings Prepared by Electrodeposition
4个月前
已完结
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