Lv41
458 积分 2025-06-21 加入
Structure characterization of nanocrystalline Ni–W alloys obtained by electrodeposition
1个月前
已完结
Fabrication and characterization of boron nitride reinforced Ni–W nanocomposite coating by electrodeposition
1个月前
已完结
Wear and Corrosion Properties of Crystalline Ni-W Alloy Coatings Prepared by Electrodeposition
1个月前
已完结
The effect of non-reactive alloying elements on the growth kinetics of the intermetallic compound between liquid Sn-based eutectic solders and Ni substrates
3个月前
已完结
Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures
3个月前
已完结
Influence of crystalline structure on diffusion barrier property of electroless Ni–Fe–P coatings in Zn–Al solder interconnects
3个月前
已完结
Significantly retarded interfacial reaction between an electroless Ni–W–P metallization and lead-free Sn–3.5Ag solder
3个月前
已完结
Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability
3个月前
已完结
Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging
3个月前
已完结
Interface Reaction between Tin Solder and Nanocrystalline Ni and Ni-Mo Coatings Obtained by Electrodeposition
3个月前
已完结
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