Lv4
678 积分 2025-06-21 加入
Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions
5天前
已完结
Effect of Ge addition on wettability, copper dissolution, microstructural and mechanical behavior of SnCu–Ge solder alloy
10天前
已完结
Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu bi-layer Barrier and Solder
20天前
已完结
Ni and Ni–P substrates inhibit Bi phase segregation and IMC overgrowth during the soldering process of Sn–Bi solder
20天前
已完结
Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3.5Ag solders
20天前
已完结
Effects of electrodeposited Co–W and Co–Fe–W diffusion barrier layers on the evolution of Sn/Cu interface
20天前
已完结
Influence of crystalline structure on diffusion barrier property of electroless Ni–Fe–P coatings in Zn–Al solder interconnects
27天前
已完结
Growth kinetics of Ni3Sn4 and Ni3P layer between Sn–3.5Ag solder and electroless Ni–P substrate
1个月前
已完结
Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints
2个月前
已完结
Study of the Interfacial Reaction between the Sn-3.5Ag Solder and Electroless Ni-P Metallization
2个月前
已完结
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