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332 积分 2024-11-14 加入
XSCAN: Explainable solder joint defect probability prediction through solder paste printing status with imbalanced data
10个月前
已完结
Prediction of Solder Joint Quality Using a Data Mining Methodology for Surface Mounted Technology Process
10个月前
已完结
Optimization study of reflow soldering profile for Surface Mount Technology
10个月前
已完结
<title>Wafer-level surface-mountable chip size packaging for MEMS and ICs</title>
10个月前
已完结
The Cause Analysis of Pseudo Solder in Surface Mounted Technology
10个月前
已完结
Effect of laser cleaning of Cu pads on wettability and interface microstructure of laser soldering
11个月前
已完结
Realization of Precise Alignment and High Reliability in Metal Interconnects for Ultra-High Pixel Density Micro-LED Arrays Based on Laser-Assisted Bonding
1年前
已完结
Effect of laser cleaning of Cu pads on wettability and interface microstructure of laser soldering
1年前
已完结
Microstructure evolution and properties of SAC305/cu BGA joints by laser jet solder ball bonding for advanced packaging
1年前
已完结
Laser-induced forward transfer for manufacture of graphite-based heaters on flexible substrate
1年前
已完结
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