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126 积分 2026-05-29 加入
Deep trench capacitor embedded in 3D-IC multi-wafer hybrid bonding package for power delivery network optimization
10小时前
已完结
Research progress of hybrid bonding technology for three-dimensional integration
10小时前
已完结
Integrated Inductor-Transformers for High-Frequency Converters: An Overview
2个月前
已完结
A Physics-Constrained Neural Network Method for Compact Modeling of Semiconductor Devices
3个月前
已完结
van Hove Source for Ultralow Power Field-Effect Transistors
4个月前
已完结
HV ESD Device Solution Evaluations in 55nm BCD Technology
4个月前
已完结
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