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18 积分 2023-11-20 加入
Pulsed electric current-assisted transient liquid phase sintering for extremely reliable Cu-Cu direct bonding
3个月前
已完结
Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography
7个月前
已关闭
Reliability of emerging bonded interface materials for large-area attachments
7个月前
已完结
Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging
7个月前
已完结
Revealing the strengthening mechanism of Cu–Sn composites joint fabricated via in-situ reaction for power electronic packaging
7个月前
已关闭
Pressureless Large Area (15 × 15 mm2) bonding by Novel Silver Paste for WBG Packaging
10个月前
已完结
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