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eon
Lv1
38 积分
2023-11-20 加入
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A rapid-sintering Cu-Cu joints with ultrahigh shear strength and super reliability for power electronics package
6天前
已完结
Unraveling the complex oxidation effect in sintered Cu nanoparticle interconnects during high temperature aging
16天前
已完结
Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles
16天前
已关闭
Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging
24天前
已完结
Microstructural evolution, fracture behavior and bonding mechanisms study of copper sintering on bare DBC substrate for SiC power electronics packaging
1个月前
已完结
Large-Area Ag/Cu Pastes Sintering on Cu Base Plates for Power Module Packaging
1个月前
已完结
Printable Copper Sintering Paste for High-Power Die-Attach Application
1个月前
已完结
High power density side-gate HIGT modules with sintered Cu having superior high-temperature reliability to sintered Ag
1个月前
已完结
Copper die-bonding sinter paste: sintering and bonding properties
1个月前
已完结
In-air sintering of copper nanoparticle paste with pressure-assistance for die attachment in high power electronics
1个月前
已完结
Fenestration of Lamina Terminalis During Anterior Circulation Aneurysm Clipping on Occurrence of Shunt-Dependent Hydrocephalus After Aneurysmal Subarachnoid Hemorrhage: Meta-Analysis
3个月前
已采纳
The miR-124-AMPAR pathway connects polygenic risks with behavioral changes shared between schizophrenia and bipolar disorder
3个月前
已采纳
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感谢,点赞,速度真快,帮大忙了,么么哒
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