Lv2
114 积分 2026-08-27 加入
Low-temperature copper sinter-joining technology for power electronics packaging: A review
1天前
已完结
Electromigration in sintered nanoporous copper
2天前
已关闭
Unraveling the complex oxidation effect in sintered Cu nanoparticle interconnects during high temperature aging
3天前
已完结
Low-Temperature-Sintered Nano-Ag Film for Power Electronics Packaging
28天前
已完结
Material Solutions for High-reliability and High-temperature Power Electronics
28天前
已完结
Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics
29天前
已完结
Heterogeneous Integration of Wide Bandgap Semiconductors and 2D Materials: Processes, Applications, and Perspectives
29天前
已完结
Morphological Changes in Sintered Silver Due to Atomic Migration
1个月前
已完结
Solvent modulation, microstructure evaluation, process optimization, and nanoindentation analysis of micro-Cu@Ag core–shell sintering paste for power electronics packaging
1个月前
已完结
Influence of sintering process on high temperature cyclic deformation behavior and fatigue creep damage mechanism of sintered silver
1个月前
已完结
皖公网安备34019202002308
