| 标题 |
Failure mechanism and theoretical model of high-temperature tensile creep of sintered nano-silver |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:He Gong; Yao-Ting Zheng; Binquan Liu; Zichen Deng; Yao Yao 出版日期:2024-03-01 |
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(2025-6-4)