Lv41
408 积分 2024-08-24 加入
Adaptive redistribution layer routing for chiplet-package co-design in 2.5D system
9小时前
已完结
FlowPlace: Flow matching for chip placement
9小时前
已完结
Redistribution layer routing for integrated fan-out wafer-level chip-scale packages
9小时前
已完结
Chiplet-Escape: An efficient obstacle-avoiding escape routing method for die-to-die interconnections in chiplet-based designs
9小时前
待确认
Correctly modeling the diagonal capacity in escape routing
9小时前
已完结
Pin assignment optimization for multi-2.5D FPGA-based systems
9小时前
已完结
Automatic die placement and flexible I/O assignment in 2.5D IC design
9小时前
已完结
Floorplanning and signal assignment for silicon interposer-based 3D ICs
9小时前
已完结
Wafer level packaging (WLP): Fan-in, fan-out and three-dimensional integration
10小时前
已完结
InFO (wafer level integrated fan-out) technology
10小时前
已完结
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