Lv3
290 积分 2024-09-16 加入
Back-Side Stress to Ease p-MOSFET Degradation on e-MRAM Chips
1天前
待确认
Effects of nitrogen composition on the resistivity of reactively sputtered TaN thin films
2个月前
已完结
The Characterization of Al Bond Pad Surface Treatment in Electroless Nickel Immersion Gold (ENIG) Deposition
2个月前
已关闭
Fast power cycling test of IGBT modules in traction application
2个月前
已完结
A review of recent MOSFET threshold voltage extraction methods
2个月前
已完结
Analysis of Al-over-Cu Bond Pad Hillock and Pit Hole Defects
2个月前
已关闭
IGBT loss analysis and junction temperature calculation based on Simulink
2个月前
已完结
Microstructure and Mechanical Properties of TaN Thin Films Prepared by Reactive Magnetron Sputtering
8个月前
已完结
Effects of nitrogen composition on the resistivity of reactively sputtered TaN thin films
8个月前
已完结
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