Lv3
230 积分 2024-09-16 加入
Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling
2天前
已完结
Resistivity Size Effect in Epitaxial Rh(001) and Rh(111) Layers
2天前
已完结
Hillock formation during electromigration in Cu and Al thin films: Three‐dimensional grain growth
30天前
已完结
Low‐energy (∼100 eV) ion irradiation during growth of TiN deposited by reactive magnetron sputtering: Effects of ion flux on film microstructure
1个月前
已完结
Hot target magnetron sputtering process: Effect of infrared radiation on the deposition of titanium and titanium oxide thin films
4个月前
已完结
Addressing interconnect challenges for enhanced computing performance
5个月前
已完结
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