Lv3
278 积分 2021-11-26 加入
High efficiency chemical mechanical polishing for silicon wafers using a developed slurry
7小时前
已完结
Preparation and Characterization of Crosslinking Polyacrylate Latex Prepared by Soap-Free Emulsion Polymerization
5个月前
已完结
Effect of Various W Film and Barrier Material on the Corrosion during W CMP
10个月前
已关闭
Effect of Fe-complex catalysts on passivation layer and hydroxyl radical generation during tungsten chemical mechanical planarization
10个月前
已完结
Effect of nanosilica abrasive properties on tungsten chemical mechanical planarization
10个月前
已完结
Fe-substituted silica via lattice dissolution–reprecipitation replacement for tungsten chemical mechanical planarization
10个月前
已完结
ALD W Metal Gate CMP
10个月前
已关闭
A special electrostatic self-assembly structure of colloidal silica: Improving Chemical Mechanical Polishing performance
10个月前
已完结
TiO2 Abrasive for Dielectric CMP Application
10个月前
已关闭
2-Picolinic acid as a naturally occurring hydrogen bond donor for the preparation of cyclic carbonates from terminal/internal epoxides and CO2
1年前
已完结
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