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364 积分 2024-07-07 加入
Thermomechanical Strength of Element Connections in Microelectronic Modules
2分钟前
求助中
Intermetallic Compounds KnMm (М = Ag, Au, As, Sb, Bi, Ge, Sn, Pb): Geometrical and Topological Analysis, Cluster Precursors, and Self-Assembly of Crystal Structures
7分钟前
求助中
Creep Rupture of a Lead-Free Sn-Ag-Cu Solder
5小时前
已完结
A Mechanistic Model for the Thermal Fatigue Behavior of the Lead-Free Solder Joints
5小时前
已完结
Size Effects in Lead Free Solder-Joints
5小时前
已完结
Ultrasonic-assisted soldering of sapphire through metallic transition layers of Al and Zn using Sn-xZn-2Al solder alloys
6小时前
已完结
Ternary and Quaternary Chalcogenides of Si, Ge, Sn, Pb, and In
7小时前
已完结
A Review of TiO2-nanoparticle Reinforced Lead-Free Solder Composites Used in Electronic Components Soldering
7小时前
已完结
Effect of Al–5Ti–0.3C–0.2B Master Alloy on the Structure and Properties of Ti6Al4V by Laser Solid Forming
2个月前
已完结
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