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130 积分 2025-11-27 加入
Experimental and Theoretical Study on failure mechanism of Superjunction MOSFET under H3TRB Testing
1个月前
已完结
Thermal creep and fatigue failure of the sintered silver solder in a SiC-IGBT module under power cycling
3个月前
已完结
Electro-Thermo-Mechanical Simulation Analysis Of Multichip SiC MOSFET Power Modules
3个月前
已完结
Effect of Porosity in Copper Nano-Sintering on the Reliability of Power Devices
7个月前
已完结
Study on the Resistivity and Porosity of Nano Copper Powder Under Low-Temperature Sintering without Pressure
7个月前
已完结
Thermo-Hygroscopic-Mechanical Coupling Simulation Method for Power Electronics Under Power Cycling Test
7个月前
已完结
Localized structural thinning monitoring with high-order Lamb wave mode enabled by direct-write ultrasonic transducers
8个月前
已完结
Cross-scale thermo-mechanical reliability study of voids defects in copper sintered interconnect layer
9个月前
已完结
Effect of Combined Freeze-Thaw and Ferrate(VI) Treatments on Escherichia coli in Phosphate-Buffered Saline
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