| 标题 |
Effect of Porosity in Copper Nano-Sintering on the Reliability of Power Devices |
| 网址 | |
| DOI | |
| 其它 |
期刊:2024 25th International Conference on Electronic Packaging Technology (ICEPT) 作者:Jian Zhan; Daoguo Yang; Minghua Xie; Chenwen Qin; Hengzhi Dong 出版日期:2024-09-24 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)