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1296 积分 2024-06-25 加入
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Analysis of Scratches Formed on Oxide Surface during Chemical Mechanical Planarization
3天前
已完结
Controlling Scratching in Cu Chemical Mechanical Planarization
3天前
已完结
Particle Adhesion and Removal in Chemical Mechanical Polishing and Post‐CMP Cleaning
3天前
已完结
Chemomechanical synergy in cobalt polishing: Non-destructive removal via atomic force microscopy at atomic levels
5天前
已完结
The Synergetic Role of Pores and Grooves of the Pad on the Scratch Formation during STI CMP
13天前
已完结
Molecular Dynamics Simulation of Single-Crystal Silicon CMP Using Ultrasonic Vibration-Assisted and Hollow Silica Abrasives
25天前
已完结
Study on Chemical Mechanical Polishing Removal Mechanism of Monocrystalline Silicon
25天前
已完结
Unprecedented atomic surface of silicon induced by environmentally friendly chemical mechanical polishing
25天前
已完结
A Study of Abrasive Rotating Velocity Effect on Monocrystalline Silicon in Ultra-Precision Mechanical Polishing via Molecular Dynamic Simulation
25天前
已完结
Monoatomic layer removal mechanism in chemical mechanical polishing process: A molecular dynamics study
25天前
已完结
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