Lv5
1296 积分 2024-06-25 加入
一个磨镜子的
Molecular Dynamics Simulation of Single-Crystal Silicon CMP Using Ultrasonic Vibration-Assisted and Hollow Silica Abrasives
11天前
已完结
Study on Chemical Mechanical Polishing Removal Mechanism of Monocrystalline Silicon
11天前
已完结
Unprecedented atomic surface of silicon induced by environmentally friendly chemical mechanical polishing
11天前
已完结
A Study of Abrasive Rotating Velocity Effect on Monocrystalline Silicon in Ultra-Precision Mechanical Polishing via Molecular Dynamic Simulation
11天前
已完结
Monoatomic layer removal mechanism in chemical mechanical polishing process: A molecular dynamics study
11天前
已完结
Contamination Mechanism of Ceria Particles on the Oxide Surface after the CMP Process
11天前
已完结
Cobalt interconnect integration: progress in metal deposition, chemical mechanical polishing, and post-CMP cleaning for advanced technology nodes
11天前
已完结
Influence of Colloidal Abrasive Size on Material Removal Rate and Surface Finish in SiO2Chemical Mechanical Polishing
11天前
已完结
Origin and distribution of redeposition layer in polished fused silica
11天前
已完结
Perspective—Recent Advances and Thoughts on Ceria Particle Applications in Chemical Mechanical Planarization
2个月前
已完结
皖公网安备34019202002308
