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338 积分 2026-01-13 加入
Perspective on thermal conductance across heterogeneously integrated interfaces for wide and ultrawide bandgap electronics
4小时前
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2D Materials Enhance Thermal Conductance at van der Waals Interfaces of β-Ga 2 O 3
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Interlayer-mediated thermal transport in β -Ga2O3/SiC heterostructures
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Single-crystal-Ga2O3/polycrystalline-SiC bonded substrate with low thermal and electrical resistances at the heterointerface
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Polycrystalline diamond heteroepitaxy on the third-generation semiconductors for thermal dissipation
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(Ultra)wide bandgap semiconductor heterostructures for electronics cooling
4小时前
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Correction to “A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces”
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A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces
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已完结
Interface bonding and thermal conductivity of synthetic diamond: A review
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Progress in the semiconductor/diamond heterogeneous integrations: Technical methods, interfacial phonon transport, and thermal characterizations
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