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20 积分 2025-11-21 加入
37.4 SHINSAI: A 586mm2 Reusable Active TSV Interposer with Programmable Interconnect Fabric and 512Mb 3D Underdeck Memory
10个月前
已完结
A 0.52mJ/Frame 107fps Super-Resolution Processor Exploiting Pseudo-FP6 Sparsity for Mobile Applications
10个月前
已完结
Edge-guided inverse design of digital metamaterial-based mode multiplexers for high-capacity multi-dimensional optical interconnect
10个月前
已完结
A 0.4–6-GHz Blocker-Tolerant Receiver in 65-nm CMOS With Bandwidth-Extended Technologies for Future V2X Applications
10个月前
已完结
PEPPR-DWS on FPGA: Elevating Universal Parallelism and Precision Through Pulse-Enhanced Push-Relabel and Diffusion Wave Search
10个月前
已完结
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