Lv1
78 积分 2026-04-11 加入
Fully diamond-based embedded manifold microchannel heat sink: Achieving ultra-high heat flux cooling
20天前
已完结
Investigation of Thermomechanical Behaviors of Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling
2个月前
已完结
A simplification method of solder joints for thermal analysis in 3D packages
2个月前
已完结
Passive Radiative Heat-Dissipating Coating with Simultaneously High Infrared Emissivity and Thermal Conductivity Enabled by In-Situ Combustion-Synthesized Hetero-structured SiC@B(C)N Particles
3个月前
已完结
Radiation‐Enhanced Heat Pipe Radiator via Surface‐Engineered Hierarchical Resin‐Free Coating for Effective Passive Heat Dissipation of High‐Power Electronic Modules
3个月前
已完结
Embedded microchannel enabling efficient thermoelectric cooler for high-heat-flux hotspot
3个月前
已完结
Scalable dry-processing of ceramic-polymer composite flexible passive daytime radiative cooling films
5个月前
已完结
皖公网安备34019202002308
