| 标题 |
Investigation of Thermomechanical Behaviors of Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Components and Packaging Technologies 作者:M.-Y. Tsai; C.H.J. Hsu; C.T.O. Wang 出版日期:2004-09-07 |
| 求助人 | |
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(2025-6-4)