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1790 积分 2023-10-16 加入
A Low-Loss Bandpass Filter With Stacked Double-Layer Structure Using Glass-Based Integrated Passive Device Technology
21天前
已完结
Development of Compact Millimeter-Wave Antenna by Stacking of Five Glass Wafers With Through Glass Vias
21天前
已完结
Electrical and optical properties of titanium nitride coatings prepared by atmospheric pressure chemical vapor deposition
1个月前
已完结
A Polyanionic Strategy to Modify the Perovskite Grain Boundary for a Larger Switching Ratio in Flexible Woven Resistive Random-Access Memories
1个月前
已完结
Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration
1个月前
已完结
Etch the borosilicate glass to form a straight through-glass-via based on the FLACE technology
1个月前
已完结
Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate
1个月前
已完结
Research on a capacitive MEMS pressure sensor based on through glass via
1个月前
已完结
Rapid and complex dynamics of through glass via formation using a picosecond quasi-continuous wave laser as revealed by time-resolved absorptance measurements and multiphase modeling
1个月前
已完结
A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis
1个月前
已完结
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