Lv3
224 积分 2023-05-31 加入
Palladium-free electroless deposition of pure copper film on glass substrate using hydrazine as reducing agent
18天前
已完结
Low Temperature Growth of High Purity, Low Resistivity Copper Films by Atomic Layer Deposition
18天前
已完结
Synthesis and comparison of copper precursor using aminoalkoxide for copper containing thin films and nanomaterials
1个月前
已完结
Growth-microstructure-thermal property relations in AlN thin films
1个月前
已完结
The Importance of Taking into Account the Heterogeneous Recombination of Atoms when Studying the Kinetics of Copper Etching in Chlorine Plasma
4个月前
已关闭
Effect of Bias Frequency on Bottom-Up SiO2 Gap-Filling Using Plasma-Enhanced Atomic Layer Deposition
9个月前
已完结
300 mm-wafer metrology for area-selective deposition in nanoscale patterns: A case study for ruthenium atomic layer deposition
9个月前
已完结
Nucleation and growth of low resistivity copper thin films on polyimide substrates by low-temperature atomic layer deposition
10个月前
已完结
Atomic layer deposition of super conformal copper seed layer for ultra-high aspect ratio through-silicon-vias
10个月前
已完结
Addressing interconnect challenges for enhanced computing performance
10个月前
已完结
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