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Grain control and property regulation of electrolytic copper foils with ethylene thiourea additive
1年前
已完结
Effects of multi-component additives on the microstructure and mechanical performance of HVLP copper foil for high-speed electronic devices
1年前
已完结
Influences of composite additives and technological parameters on the microstructure and properties of electrolytic copper foil
1年前
已完结
Theoretical Research and Application of Additive DPS in the Electrochemical Microroughening Layer of Copper Foil
1年前
已完结
Preparation of high-strength, high-extensibility, and low-roughness ultrathin twinned copper foil: A study on the application of a novel additive, sodium 2-mercapto-5-benzimidazole sulfonate
1年前
已完结
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