Lv12
17 积分 2024-05-11 加入
Effects of scaling and grain structure on electromigration reliability of Cu interconnects
13小时前
已完结
Grain Size And Cap Layer Effects On Electromigration Reliability Of Cu Interconnects: Experiments And Simulation
1天前
已完结
Modulating self-heating effects in FinFETs through doping engineering
17天前
已完结
Semiconductor Reliability Analysis and Modeling
1个月前
已关闭
Focus leveling improvement using optimized wafer edge settings
5个月前
已完结
Interface-state effects in irradiated MOS structures
1年前
已完结
Oxide charge accumulation in metal oxide semiconductor devices during irradiation
1年前
已完结
TCAD-based investigation of 1/f noise in advanced 22 nm FDSOI MOSFETs
1年前
已完结
Innovative Designs of 3D Heat Sinks by Topology Optimization
1年前
已关闭
Low-Frequency Noise in Partially Depleted SOI MOSFETs Operating from Linear Region to Saturation Region at Various Temperatures
1年前
已完结
皖公网安备34019202002308
