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10 积分 2026-07-06 加入
Reliability Analysis of Cu Sintered Die-Attach for SiC Power Devices: Mechanical, Electrical, and Thermal Evaluation
23天前
已完结
Transient liquid phase bonding using Cu foam and Cu–Sn paste for high-temperature applications
23天前
已完结
Design and Characterization of a Novel Double-side Cooled Press-pack Packaging Structure
1个月前
已完结
Design of a Novel Double Sided Cooling SiC Power Module Based on Multiple DBC-Stacked
1个月前
已完结
Rapid equiaxed Cu3Sn formation and high-temperature reliability of transient liquid phase bonding with an Sn/2 μm Cu/Sn preform
1个月前
已完结
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