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40 积分 2024-11-18 加入
A Novel Approach to Improve Heat Dissipation of AlGaN/GaN High Electron Mobility Transistors with a Backside Cu Via
16小时前
待确认
Thermal management materials for 3D-stacked integrated circuits
4个月前
已完结
Gate Leakage Current Characterization and Remaining Useful Lifetime Prediction in Silicon Carbide MOSFETs
5个月前
已完结
Fabrication of through sapphire vias by femtosecond laser bidirectional drilling
5个月前
已完结
Analysis of the novel Si/SiC heterojunction IGBT characteristics by TCAD simulation
5个月前
已完结
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