Lv3
212 积分 2026-04-09 加入
Research on the Thermal Design of a Certain Electronic Device Structure
3天前
已完结
Thermal interface material performance in microelectronics packaging applications
3天前
已完结
Numerical Studies on Spectrally Selective Characteristics and Heat Transfer Mechanism of PMMA/SiO 2 Radiative Cooling Film
17天前
已完结
Reference Values and Reference Correlations for the Thermal Conductivity and Viscosity of Fluids
17天前
已完结
Numerical and analytical analysis of an ultrahigh sensitive surface plasmon resonance sensor based on a black phosphorene/graphene heterostructure
21天前
已完结
A numerical investigation of the impact of various parameters on the flow and heat transfer in a rectangular duct with inclined obstacles
30天前
已完结
Weather-Resistant Janus-Nozzle Electrospinning Nanofibers with Heterogeneous Interfaces Enable Complementary Infrared Emission for Multifunctional Radiative Cooling Windows
30天前
已关闭
2D‐Network VO 2 Metasurface‐Integrated Adaptive Radiative Thermal Device With Ultra‐Low Solar Absorptance for Spacecraft Thermal Control
30天前
已关闭
Radial Manifold Microchannel Heat Sink for Electronics Thermal Management
1个月前
已完结
Recent advances in hexagonal boron nitride based thermal interface materials: A minor review
2个月前
已完结
皖公网安备34019202002308
