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110 积分 2026-03-23 加入
Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy
1小时前
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Effect of bonding temperature on the microstructure, IMCs growth, and shear property of Cu/Sn-9Zn-30Cu/Cu solder joint by transient liquid phase bonding
2个月前
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Cobalt ion stabilized ammonium vanadate as a high-performance aqueous zinc-ion battery cathode
2个月前
已完结
Synergistic role of Bi, Ni, and Pd alloying in SAC305 for enhanced IMC suppression and superior thermo-mechanical performance
3个月前
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Shear performance of microscale ball grid array structure Cu(Ni)/Sn–3.0Ag–0.5Cu/Cu(Ni) solder joints at low temperatures
3个月前
已完结
Influence of temperature gradient bonding on the micromorphology and shear performance of Sn-based solder joints: Experiments and first principles calculations
3个月前
已完结
In-situ EBSD investigation on shear deformation mechanism and fracture behavior of Ni@CF composite solder joints
5个月前
已完结
Microstructure and performance enhancement of Sn58Bi solder joints on Cu substrate with submicron In particles addition
5个月前
已完结
Microstructure and properties of ultrasonic-assisted soldered 6061Al/Sn-xAg joints
5个月前
已完结
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