Lv2
130 积分 2026-03-23 加入
Mechanical property and fracture behavior characterizations of 96.5 Sn–3.0 Ag–0.5 Cu solder joints
2天前
已完结
Broadband Microwave Absorption of Nb2CTx Nanosheets by a One-Step Hydrothermal Method
19天前
已完结
Effect of thermal aging on microstructure and mechanical properties of indium-doped Sn-Ag-Cu lead free solder alloys
2个月前
已关闭
Structural characterization and creep resistance of nano-silicon carbide reinforced Sn–1.0Ag–0.5Cu lead-free solder alloy
2个月前
已关闭
Effect of bonding temperature on the microstructure, IMCs growth, and shear property of Cu/Sn-9Zn-30Cu/Cu solder joint by transient liquid phase bonding
4个月前
已关闭
Cobalt ion stabilized ammonium vanadate as a high-performance aqueous zinc-ion battery cathode
4个月前
已完结
Synergistic role of Bi, Ni, and Pd alloying in SAC305 for enhanced IMC suppression and superior thermo-mechanical performance
5个月前
已关闭
Shear performance of microscale ball grid array structure Cu(Ni)/Sn–3.0Ag–0.5Cu/Cu(Ni) solder joints at low temperatures
5个月前
已完结
Influence of temperature gradient bonding on the micromorphology and shear performance of Sn-based solder joints: Experiments and first principles calculations
5个月前
已完结
In-situ EBSD investigation on shear deformation mechanism and fracture behavior of Ni@CF composite solder joints
7个月前
已完结
皖公网安备34019202002308
