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Shellac-based delivery systems for food bioactive compounds
1个月前
已完结
Molecular mechanisms and applications of tea polyphenols: A narrative review
1个月前
已完结
Polysaccharides, proteins, and their complex as microencapsulation carriers for delivery of probiotics: A review on carrier types and encapsulation techniques
1个月前
已完结
Effects of different content of EGCG or caffeic acid addition on the structure, cooking, antioxidant characteristics and in vitro starch digestibility of extruded buckwheat noodles
1个月前
已完结
Difference in the antibacterial action of epigallocatechin gallate and theaflavin 3,3'‐di‐ O ‐gallate on Bacillus coagulans
1个月前
已完结
Co‐encapsulated of potential probiotic yeast Kluyveromyces marxianus and peanut skin polyphenolic extract as a functional ingredient
1个月前
已完结
Co‐encapsulated of potential probiotic yeast Kluyveromyces marxianus and peanut skin polyphenolic extract as a functional ingredient
2个月前
已关闭
The construction of a double-layer colon-targeted delivery system based on zein-shellac complex and gelatin-isomaltooligosaccharide Maillard product: In vitro and in vivo evaluation
2个月前
已完结
Electrospray whey protein-polysaccharide microcapsules co-encapsulating Lactiplantibacillus plantarum and EGCG: Enhanced probiotic viability and antioxidant activity
2个月前
已完结
Molecular insights into shellac film coats from different aqueous shellac salt solutions and effect on disintegration of enteric-coated soft gelatin capsules
4个月前
已完结
The development of an improved physical surrogate model of the human spinal cord—Tension and transverse compression
4个月前
已采纳
Deformation and failure processes of Na-montmorillonite under uniaxial compressive strain condition via molecular dynamic method
5个月前
已采纳
Effect of Polar Interactions on Polymer Dynamics
6个月前
已采纳
Cancer‐associated venous thrombosis in adults (second edition): A British Society for Haematology Guideline
6个月前
已采纳
Reclamation and reuse of graphite from electric vehicle lithium-ion battery anodes via water delamination
6个月前
已采纳
A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air
9个月前
已采纳
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