Lv5
810 积分 2026-06-22 加入
Performance analysis and structural optimization of a finned liquid-cooling radiator for chip heat dissipation
1个月前
已完结
Performance analysis and structural optimization of the microchannel heat sink for high power multi-chip heat dissipation
1个月前
已完结
A review of thermal performance of 3D stacked chips
1个月前
已完结
Design of Microchannels Embedded in HTCC Substrate for Heat Dissipation of SiP With Multiple Chips
1个月前
已完结
Experimental study on the hotspot cooling performance of immersion chips based on micro heat pipe arrays
1个月前
已完结
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