Lv5
1090 积分 2026-06-22 加入
Topology optimization and experimental study of 3D-printed microchannel cold plates for multi-chip heat dissipation
12天前
已完结
Gradient-optimized triply periodic minimal surface (TPMS) cold plates for chip cooling under two scenarios: Single and multi-heat sources
12天前
已完结
Optimizing the heat source layout of chips using bionic method: Reduction of junction temperature
12天前
已完结
Optimization of fin layout in liquid-cooled microchannels for multi-core chips
19天前
已完结
Gradient-optimized triply periodic minimal surface (TPMS) cold plates for chip cooling under two scenarios: Single and multi-heat sources
19天前
已完结
Performance analysis and structural optimization of a finned liquid-cooling radiator for chip heat dissipation
2个月前
已完结
Performance analysis and structural optimization of the microchannel heat sink for high power multi-chip heat dissipation
2个月前
已完结
A review of thermal performance of 3D stacked chips
2个月前
已完结
Design of Microchannels Embedded in HTCC Substrate for Heat Dissipation of SiP With Multiple Chips
2个月前
已完结
Experimental study on the hotspot cooling performance of immersion chips based on micro heat pipe arrays
3个月前
已完结
皖公网安备34019202002308
