Lv522
1110 积分 2026-06-22 加入
Energy efficient hotspot-targeted embedded liquid cooling of electronics
7天前
已完结
Rational thermal design of 2.5D heterogeneously integrated systems via topology optimization coupled with micro-rib texturing
17天前
已完结
Multi-Objective Optimization of an Embedded Jet Microchannel Heat Sink for Thermal Management of High-Heat-Flux Ai Chips With Multiple Hotspots
18天前
已完结
Numerical study of distributed jet microchannels with Micro-pin-fins: Structural comparison and temperature uniformity optimization
19天前
已完结
A novel simulated annealing algorithm for TTSV placement optimization in 3D integrated circuits with inhomogeneous heat sources
20天前
已完结
Multi-objective topology optimization for microchannel cooling structures in high heat flux chip arrays
20天前
已完结
A hybrid pump-driven phase-change cooling system incorporating capillary evaporation and liquid-gas ejection for thermal management of high-heat-flux chip arrays
20天前
已完结
Gradient-optimized triply periodic minimal surface (TPMS) cold plates for chip cooling under two scenarios: Single and multi-heat sources
20天前
已完结
Automatic Optimization System for Heat Source Layout of Multi-Chip Components Based on Multi-Software Integration
20天前
已完结
Machine learning-driven hotspot thermal management in chip heat sinks through topology optimization
20天前
已完结
皖公网安备34019202002308
