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60 积分 2024-08-23 加入
Recent Advances in Device-Level Thermal Management Technologies for Wide Bandgap Semiconductor: A Review
11小时前
已完结
A review of the research and development of high-frequency, high-power gallium nitride radio-frequency electronic devices
1个月前
已完结
Design of Microchannels Embedded in HTCC Substrate for Heat Dissipation of SiP With Multiple Chips
3个月前
已完结
Research on Liquid Cooling Test Technology of Ceramic Substrate Packaging Embedded Microchannel
3个月前
已完结
High-$k$/Diamond RF MOSFETs with Record High $f_{\mathrm{T}}/f_{\max}$ of 90/164 GHz and First Demonstration of a Diamond MMIC
4个月前
已完结
Temperature Uniformity in Cross-Flow Double-Layered Microchannel Heat Sinks
6个月前
已完结
In-Chip Microfluidic Cooling Integrated on GaN Power IC Reaching High Power Density of 78 kW/l
6个月前
已完结
Simplified Evaluation on Cooling Performance of Silicon Microfluidic Interposer
6个月前
已完结
Enhanced performance of Ku-band GaN MMIC PA through embedded microfluidic cooling
6个月前
已完结
Subcooled flow boiling in diamond/Cu microchannel heat sinks for near-junction chip cooling
11个月前
已完结
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